| 摘要 |
PROBLEM TO BE SOLVED: To provide a cure accelerating compound-gel complex capable of imparting excellent storage stability, a curable resin composition containing it and an electronic component device having an element encapsulated with the curable resin composition. SOLUTION: The cure accelerating compound-gel complex is prepared by reacting (a) a cure accelerating compound, (b) a compound having a phenolic hydroxyl group and (c) at least one compound selected from the compounds indicated by general formula (I-1) and partial condensation products thereof. In the formula n is 0 or 1; R<SP>1</SP>is selected from the group consisting of a hydrogen atom and a 1-18C substituted or unsubstituted hydrocarbon group and may be bonded with one or more R<SP>2</SP>to form a cyclic structure; and R<SP>2</SP>indicate a functional group reactive with a phenolic hydroxyl group and are each independently selected from the group consisting of a halogen atom, a hydroxyl group, a 1-18C substituted or unsubstituted oxy group, a 0-18C substituted or unsubstituted amino group and 2-18C substituted or unsubstituted carbonyloxy group, all may be the same or different, and two or more of R<SP>2</SP>may mutually be bonded to form a cyclic structure. COPYRIGHT: (C)2009,JPO&INPIT
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