发明名称 POLYAMIDE RESIN COMPOSITION FOR LAMINATED FILM
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition used for giving laminated films having high gas barrier properties, do not produce waviness even upon large deformation, and therefore can exhibit secured sealability with a view to cope with such a situation that laminated films made from a flexible resin layer and a gas barrier material layer are used in applications requiring flexibility and gas barrier properties, but such laminated films can not have secured sealability because they are each composed of layers of greatly different properties and therefore produce uneven elongation and lateral waviness when elongated. SOLUTION: The laminated film is one in which the barrier layer has an upper yield strength of 15-45 MPa and a neck-in ratio of 0.75-0.995 when subjected to a tensile test on a unitary part at 23°C and is made from a polyamide resin composition for laminated films. In one particularly desirable embodiment, the barrier layer is made from a polyamide resin composition which is composed of a composition of a polyamide resin having a melting point of 200-275°C and 10-50 mass% elastomer having a flexural modulus of 500 MPa or lower and dispersed therein as particles of an average particle diameter of 0.01-3.0μm. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008247969(A) 申请公布日期 2008.10.16
申请号 JP20070087794 申请日期 2007.03.29
申请人 TOYOBO CO LTD 发明人 YOSHIHARA NORI
分类号 C08L77/00;C08L21/00 主分类号 C08L77/00
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