发明名称 |
Substrate Cleaning Method, Substrate Cleaning Equipment, Computer Program, and Program Recording Medium |
摘要 |
In a dry process after a cleaning process using a cleaning-liquid nozzle and a rinse process using a side rinse nozzle are performed on a wafer W, the wafer W is turned, feeding of pure water to a center point of the wafer W from a pure-water nozzle is started, and substantially at the same, injection of a nitrogen gas from a gas nozzle to a center portion of the wafer W at a point at an adequate distance apart from the center of the wafer W is started. Next, while the pure-water nozzle is caused to scan toward the periphery of the wafer W, the gas nozzle is caused to scan toward the periphery of the wafer W in an area radially inward of the position of the pure-water nozzle after the gas nozzle passes the center of the wafer W.
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申请公布号 |
US2008251101(A1) |
申请公布日期 |
2008.10.16 |
申请号 |
US20050594549 |
申请日期 |
2005.04.19 |
申请人 |
OHNO HIROKI;SEKIGUCHI KENJI |
发明人 |
OHNO HIROKI;SEKIGUCHI KENJI |
分类号 |
B08B5/00;B08B3/02;B08B3/04;B08B5/02;B08B13/00;G02F1/13;G02F1/1333;H01L21/00;H01L21/304 |
主分类号 |
B08B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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