| 摘要 |
A resin substrate for a camera module, a manufacturing method thereof, and the camera module having the same and a manufacturing method thereof are provided to prevent side pads connected to an external terminal in a side method from being polluted by a thermosetting bonding agent, thereby improving accessibility to the external terminal through the side pads. A resin substrate(100) for a camera module includes a lower substrate(110), cut-off films(120), and an upper substrate(130). A plurality of contact holes(111) is formed in the side of the lower substrate. A side pad(112) is installed in each of the contact holes. The cut-off films are installed on the upper surface of the lower substrate to close the upper opening portions of the contact holes. The upper substrate covers the cut-off films and is laminated on the upper part of the lower substrate.
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