| 摘要 |
<P>PROBLEM TO BE SOLVED: To protect a wiring on a surface of a chip by preventing effluence of a liquid resin. <P>SOLUTION: A semiconductor device includes a first chip 10 rectangular in plan view having a wiring, electrode pads 14 and a chip mounting region; first dams 16 provided around the electrode pads 14 and the chip mounting region on the chip 10 and having the covered wiring; a second chip 12 rectangular in plan view flip-chip mounted on the chip mounting region; and an underfill 18 formed by filling the liquid resin between the first chip 10 rectangular in plan view. <P>COPYRIGHT: (C)2009,JPO&INPIT |
