| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that can be thinned while promoting the radiation of heat from a semiconductor light-emitting element. <P>SOLUTION: The semiconductor light-emitting device A comprises: a lead frame 1 having front and rear surfaces; an LED chip 2 mounted on the surface of the lead frame 1; a case 4 for covering one portion of the lead frame 1; and a light-transmitting member 5 for covering the LED chip 2. The lead frame 1 has a fixed thickness, and the back of a die-bonding pad where the LED chip 2 is mounted is exposed from a case 4. The lead frame 1 has protrusion sections 11b, 12b projecting in a direction where the surface faces as compared with the die-bonding pad. <P>COPYRIGHT: (C)2009,JPO&INPIT |
