发明名称 SOLDER RESIST, DRY FILM THEREOF, CURED PRODUCT AND PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a solder resist which enables to have both adequate sensitivity during exposure and alkali developability, is excellent in dimensional stability against temperature change, does not exhibit brittleness, and enables to obtain a cured product which is excellent in water resistance, electrical insulation, temperature cycle resistance (TCT resistance) and the like, a dry film having a solder resist layer, a cured product and a printed wiring board. <P>SOLUTION: The solder resist contains an acid-modified vinyl ester which is synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, while using a crystalline epoxy resin having a melting point of &ge;90&deg;C as at least a part of the epoxy compound and using a compound having a bisphenol S skeleton as at least a part of the phenol compound. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008250305(A) 申请公布日期 2008.10.16
申请号 JP20080052405 申请日期 2008.03.03
申请人 NIPPON SHOKUBAI CO LTD;TAIYO INK MFG LTD 发明人 OTSUKI NOBUAKI;AKIYAMA MANABU;MINEGISHI MASASHI;ARIMA MASAO
分类号 G03F7/038;C08F290/06;C08F299/00;C08G59/17;C08G59/42;G03F7/004;H05K3/28 主分类号 G03F7/038
代理机构 代理人
主权项
地址