发明名称 |
INTEGRATED CIRCUIT DEVICE AND ELECTRONIC INSTRUMENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a slim/slender integrated circuit device and an electronic instrument containing the same. SOLUTION: The integrated circuit device 10 includes a pad PDx and an electrostatic protective element ESDx that is formed in a rectangular region and is electrically connected to the pad. The pad PDx is disposed on an upper layer of the electrostatic protective element so as to allow the arrangement direction of the pad and the rectangular direction of a region where the electrostatic protective element ESDx is formed to be in parallel and to be overlapped on a part or all of the electrostatic protective element ESDx. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2008252109(A) |
申请公布日期 |
2008.10.16 |
申请号 |
JP20080124746 |
申请日期 |
2008.05.12 |
申请人 |
SEIKO EPSON CORP |
发明人 |
KUMAGAI TAKASHI;ISHIYAMA HISANORI;MAEKAWA KAZUHIRO;ITO SATORU;FUJISE TAKASHI;KARASAWA JUNICHI;KODAIRA SATORU;SAIKI TAKAYUKI;TAKAMIYA HIROYUKI |
分类号 |
H01L21/822;H01L27/04;H01L27/06 |
主分类号 |
H01L21/822 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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