| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of a structure wherein external connection terminals inserted in a mold based on insert molding are joined by wire bonding to an electric circuit located in the mod to be electrically connected thereto and insulatively injected therein with an insulating injection resin, and which can prevent cracking of the injection resin. SOLUTION: An insert mold has external connection terminals 120 inserted in a mold 100 of a molding material by insert molding and also has an electric circuit located in the mold 100 and then which is molded with an insulating injection resin. The insert mold has a wire bonding area where the external connection terminals 120 are joined to the electric circuit by wire bonding using wires 150 to be electrically connected thereto, and is surrounded by projections 71 which are projected from the surface level of the wire bonding area. COPYRIGHT: (C)2009,JPO&INPIT
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