发明名称 |
Method of Manufacturing Multi-Layer Circuit Board |
摘要 |
A method of manufacturing a multi-layer circuit board having the following steps: preparing a laminated member formed of a core circuit board having a circuit pattern thereon and a prepreg sheet having a through-hole filled with conductive paste; forming a laminated structure in a manner that the laminated member is sandwiched by lamination plates; and applying heat and pressure to the laminated structure. According to the method, selecting a lamination plate so as to have thermal expansion coefficient equivalent to that of a core circuit board can protect conductive paste from distortion, thereby offering a high-quality multi-layer circuit board with reliable connection resistance.
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申请公布号 |
US2008251193(A1) |
申请公布日期 |
2008.10.16 |
申请号 |
US20050595157 |
申请日期 |
2005.09.30 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TAKENAKA TOSHIAKI;KAWAKITA YOSHIHIRO;TOJYO TADASHI;SUGITA YUICHIRO |
分类号 |
B32B37/14 |
主分类号 |
B32B37/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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