发明名称 |
CURATIVES FOR EPOXY COMPOSITIONS |
摘要 |
<p>The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.</p> |
申请公布号 |
WO2008124797(A1) |
申请公布日期 |
2008.10.16 |
申请号 |
WO2008US59804 |
申请日期 |
2008.04.09 |
申请人 |
DESIGNER MOLECULES, INC.;DERSHEM, STEPHEN |
发明人 |
DERSHEM, STEPHEN |
分类号 |
C08G69/14;C08G59/62 |
主分类号 |
C08G69/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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