THERMOCURABLE RESIN COMPOSITION COMPRISING SEMI-IPN-TYPE COMPLEX, AND VARNISH, PREPREG AND METAL-CLAD LAMINATE SHEET USING THE SAME

摘要

Disclosed is a thermocurable resin composition which can be used for production of a print circuit board showing good dielectric properties at high frequency bands, capable of significantly reduce the propagation loss, excellent in moisture-absorbability/heat resistance and thermal expansion properties, and providing a satisfactory level of peeling strength between the print circuit board and a metal foil. The thermocurable resin composition comprises a semi-IPN-type complex which comprises: a polyphenylene ether (A); and a prepolymer comprising a butadiene polymer (B) and a cross-linking agent (C); wherein the butadiene polymer (B) contains a 1,2-butadiene unit having a 1,2-vinyl group in a side chain in an amount of 40% or larger in the molecule and is chemically unmodified, and wherein the polyphenylene ether (A) and the prepolymer are dissolved in each other and are in uncured form. Further disclosed are a resin varnish, a prepreg and a metal-clad laminate sheet using the resin composition.