| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermocompression head that has a temperature keeping function of a thermocompression tool, and also to provide a mounting device equipped with the thermocompression head, and a mounting method using the thermocompression head. <P>SOLUTION: The bottom and side of a semiconductor chip 3 with a connection terminal 3a kept downward on a thermocompression tool 30 are surrounded by freely opening and closing shutters 33a and 33b. When the shutters 33a and 33b are closed, the temperature of the thermocompression tool 30 is kept within the shutters shielded from the outside, so that the thermal efficiency of a heater 31 is improved, and its power consumption is reduced to a larger extent. When mounting the semiconductor chip 3 to a substrate, the shutters 33a and 33b are opened, and they are evacuated to a position not hindering the mounting operation of the semiconductor chip 3. <P>COPYRIGHT: (C)2009,JPO&INPIT |
