发明名称 MANUFACTURING METHOD OF LIGHT-RECEIVING ELEMENT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a light-receiving element, capable of preventing a second conductivity-type impurity from diffusing on a first semiconductor layer of a light-receiving section. <P>SOLUTION: In a laminate in which a first semiconductor layer (6) made of a first conductivity-type InP and a second semiconductor layer (7) made of a second conductivity-type InP are sequentially formed on a semiconductor substrate (1), the manufacturing method of a semiconductor device (100) includes a step of forming a diffusion suppressing layer (8) containing at least any one of InGaAs and InGaAsP on at least one part of a light-receiving region (7a) of the second semiconductor layer, a step of forming an insulating layer (9) on the diffusion suppressing layer, and a step of thermally diffusing a second conductivity-type impurity into one part of the first semiconductor layer by executing thermal diffusion in an atmosphere containing the second conductivity-type impurity while using the diffusion suppressing layer and the insulating layer as thermal diffusion masks. <P>COPYRIGHT: (C)2009,JPO&INPIT</p>
申请公布号 JP2008251729(A) 申请公布日期 2008.10.16
申请号 JP20070089660 申请日期 2007.03.29
申请人 EUDYNA DEVICES INC 发明人 HANAWA IKUO;DOMOTO SHINICHI;ARAI MORITA;KOYAMA YUJI
分类号 H01L31/10 主分类号 H01L31/10
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