SEMICONDUCTOR LIGHT EMITTING DEVICE

摘要

A semiconductor light emitting device (A) is provided with a leadframe (1) having a fixed thickness; a semiconductor light emitting element (2) supported by the leadframe (1); a case (4) covering a part of the leadframe (1); and a light transmitting member (5) for covering the semiconductor light emitting element (2). The lead frame (1) includes a die bonding pad (11a) and a protruding section (11b). The die bonding pad (11a) has a front surface for mounting the semiconductor light emitting element (2), and a rear surface exposed from the case (4). The protruding section (11b) is arranged by being offset from the die bonding pad (11a) in a normal line direction of the front surface of the die bonding pad (11a).