| 摘要 |
A lead-free alloy for soldering is provided to improve physical and mechanical properties, reduce dross amounts, and enable soldering work at a low temperature by adding K and Bi to the alloy. A lead-free alloy for soldering is made by including Ag, Cu, P, K, and Sn which is a main component. The lead-free alloy includes Ag of 0.1 to 6.0 weight%, Cu of 0.05 to 7.5weight%, P of 0.001 to 3.0weight%, and K of 0.001 to 0.5weight%. Bi of 0.1 to 3.0weight% is additionally contained. |
