METHOD AND APPARATUS FOR WAFER EXPOSURE

摘要

A method and apparatus for exposing a wafer are provided to prevent wafer contamination due to a pattern defect of an edge chip die by implementing a uniform effective focus distribution over the whole region of the wafer. A test exposing is performed on an initial test wafer(101). An exposure defect level per a region with respect to the test wafer is measured. A wafer flatness control level for compensating an exposure defect is extracted(102). The process wafer is mounted on a wafer stage of an exposure equipment so as to corresponding to the flatness control level and a height of an edge section of the process wafer is varied based on a height of the center of the process wafer(103). An exposure light source is irradiated to the mounted process wafer to expose it(104). The exposure defect level is obtained by measuring a wafer bit map on the test wafer. The wafer flatness control level is extracted from a defect generation level at an edge region of the wafer bit map.