NON-PLANAR CIRCUIT BOARD AND A METHOD FOR FABRICATING THE SAME

摘要

A method for forming a circuit board is provided. The method includes for ming a circuit board substrate (112) from a circuit board material. The meth od also includes positioning the circuit board substrate on a rigid structur e (114) having a three dimensional contoured surface (300). The method furth er includes applying heat and applying pressure to the circuit board substra te to at least partially conform the circuit board substrate to the three di mensional contoured surface. If the circuit board substrate (112) is a clad circuit board substrate, then a circuit pattern is formed on the circuit boa rd substrate prior to the steps of applying heat and applying pressure. Howe ver, if the circuit board substrate (112) is an unclad circuit board substra te, then a circuit pattern is disposed on the circuit board substrate after the steps of applying heat and applying pressure.