| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To reduce influences of noise caused by crosstalk between data system wiring lines connecting chips to each other and capacitive coupling by making it possible to equalize lengths of inter-chip wiring lines of an address system. <P>SOLUTION: A plurality memory chips (3, 4) that a data processor (2) accesses in parallel are mounted to a module substrate in a stack state. Address-system bonding pads corresponding to the plurality of memory chips are connected in common to a bonding lead at the other end of a module substrate wiring line having one end connected to an address-system bonding pad of the data processor by a wire. Data-system bonding pads of the data processor chip are connected to data-system bonding pads of the memory chips individually. The data-system bonding pads that the memory chips connected by data-system wiring lines correspond to are so arrayed that the memory chips are alternately different from an array of the plurality of data-system bonding pads of the data processor chip. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
