| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To shorten the length of a bonding wire while suppressing the size of a semiconductor device, in the semiconductor device configured by laminating a plurality of semiconductor elements. <P>SOLUTION: The semiconductor device comprises: a substrate for the semiconductor device provided with a connection terminal; a first semiconductor element provided on the substrate; an interposer provided on the first semiconductor element, where a rectangular opening is formed, a first pad is formed in each of adjacent regions of four sides forming the opening on the upper surface and a second pad electrically connected to the first pad is formed at the outer edge part of the upper surface; and a rectangular second semiconductor element provided inside the opening. The interposer is provided with at least one layer of a core base material and a wiring pattern formed on at least one main surface of the core base material. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
