| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light-emitting device that can be miniaturized and can increase luminance. <P>SOLUTION: The semiconductor light-emitting device A comprises: a lead frame 1 having a bonding section 11; an LED chip 2 mounted on the surface of the bonding section 11; and a case 3 for covering one portion of the lead frame 1. The back of the bonding section 11 is exposed from a case 3. The lead frame 1 is extended from the bonding section 11, allows the surface to be flush with that of the bonding section 11, and further has a thin extension section 12 where the back is positioned inside the case 3 as compared with the back of the bonding section 11. <P>COPYRIGHT: (C)2009,JPO&INPIT |
