| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a package capable of obtaining an optical semiconductor device capable of preventing contamination by an adhesive to the periphery and the deformation of a lens and the deviation of an optical axis caused by contraction of the adhesive by surely supplying a fixed amount of the adhesive to an adhesion margin. <P>SOLUTION: A first groove 7 for fitting the lens is formed around a housing part 4, a recess 9 is formed at a position separated from the groove 7, and a second groove 8 communicating the first groove 7 and the recess 9 is formed shallower than the first groove 7. When the adhesive material is poured into the first groove 7, it flows out through the second groove 8 to the recess 9, the liquid surface of the first groove 7 is kept fixed, the periphery is not contaminated by the intrusion of the adhesive, and the deformation of the lens and the deviation of the optical axis caused by stress when the adhesive is contracted by the excessive adhesive are prevented. <P>COPYRIGHT: (C)2009,JPO&INPIT |
