| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating substrate which achieves high thermal conductivity in the direction of the thickness of a substrate, and offers superior heat dissipation properties that allow the heat dissipating substrate to fully cope with an increase in heat generation quantity and heat generation density due to the enhanced function and the density and reduced size of a semiconductor. SOLUTION: The heat dissipating substrate includes at least one or more metal heat dissipators 11, which are embedded in insulating materials 21, 22 with the upper and lower surfaces exposed, and are electrically independent, respectively. Each metal heat dissipator 11 is so formed that the upper surface is smaller in area than the lower surface. A heat-generating element 10 is mounted on the upper surface of the metal heat dissipator 11, and an electronic component 13 other than the heat-generating element 10 is mounted on the upper surface of the insulating material 21. COPYRIGHT: (C)2009,JPO&INPIT |
