| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device by which productivity in the manufacturing step for a semiconductor device can be improved. SOLUTION: This method is used to manufacture a semiconductor device, wherein substrate contacts are formed on a prepared SOI wafer to connect semiconductor functional elements and a support substrate constituting the SOI wafer; a pattern is formed to connect the substrate contacts and external connection pads, formed on the semiconductor functional elements with one another so that the external connection pads so as not to be connected to one another; and conductivity among the external connection pads is measured. COPYRIGHT: (C)2009,JPO&INPIT |
