| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating resin sheet with a copper foil having excellent adhesive properties with an insulating layer the multi-layer printed wiring board capable of a thin and fine wiring circuit using the insulating resin sheet when the insulating layer for a multi-layer printed wiring board is formed and its manufacturing method, and a semiconductor device using the multi-layer printed wiring board and excellent in reliability. SOLUTION: The insulating resin sheet with the copper foil is obtained by making a resin composition being an insulating layer for the multi-layer printed wiring board overlie an electrolytic copper foil layer of a peelable type copper foil made by bonding a releasable carrier foil layer and the electrolytic copper foil layer with a thickness of 0.5-5.0μm. The method for manufacturing the multi-layer printed wiring board comprises the insulating layer forming process in which the insulating resin sheet with the copper foil is laminated on a face on which inner layer circuit pattern of an inner layer circuit board is formed, the process in which a hole is made in the insulating layer by laser irradiation, and the process for forming a conductor circuit layer to obtain the multi-layer printed wiring board. In addition, the semiconductor device is constituted by mounting a chip on the multi-layer printed wiring board. COPYRIGHT: (C)2009,JPO&INPIT |
