发明名称 METHOD AND APPARATUS FOR APPLYING SOLUTION
摘要 PROBLEM TO BE SOLVED: To improve the speed and the precision for calculating the discharge quantity of droplets to cope with expected demand hereafter in the application of a solution on a substrate. SOLUTION: In the method of applying the solution by which the solution is applied on the substrate 1, the discharge quantity of the droplet L is calculated on the basis of the calculated thickness of the droplet L by previously determining the relation thickness/absorbance between the thickness of droplet L applied on the substrate 1 and the absorbance in the absorption of light passing through the droplet L, measuring the absorbance of light with which the droplet L applied on the substrate 1 is irradiated and calculating the thickness of the droplet L corresponding to the measured absorbance based on the relation of the thickness/absorbance of the droplet L. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008246435(A) 申请公布日期 2008.10.16
申请号 JP20070093671 申请日期 2007.03.30
申请人 SHIBAURA MECHATRONICS CORP 发明人 MATSUSHIMA DAISUKE
分类号 B05D3/00;B05C5/00;B05C11/10;B05D1/26;G01B11/02 主分类号 B05D3/00
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