发明名称 Fluid Handling System for Wafer Electroless Plating and Associated Methods
摘要 A chemical fluid handling system is defined to supply a number of chemicals to a number of fluid inputs of a mixing manifold. The chemical fluid handling system includes a number of fluid recirculation loops for separately pre-conditioning and controlling the supply of each of the number of chemicals. Each of the fluid recirculation loops is defined to degas, heat, and filter a particular one of the number of chemical components. The mixing manifold is defined to mix the number of chemicals to form the electroless plating solution. The mixing manifold includes a fluid output connected to a supply line. The supply line is connected to supply the electroless plating solution to a fluid bowl within an electroless plating chamber.
申请公布号 US2008251148(A1) 申请公布日期 2008.10.16
申请号 US20070735989 申请日期 2007.04.16
申请人 LAM RESEARCH CORPORATION 发明人 THIE WILLIAM;BOYD JOHN M.;REDEKER FRITZ C.;DORDI YEZDI;PARKS JOHN;ARUNAGIRI TIRUCHIRAPALLI;OWCZARZ ALEKSANDER;BALISKY TODD;THOMAS CLINT;WYLIE JACOB
分类号 B01F5/00 主分类号 B01F5/00
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