发明名称 WIRING STRUCTURE AND ITS FORMING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To easily and surely form a wiring whose material is a linear structure of carbon element using a contact block, at a low cost, while reducing the number of processes as much as possible. <P>SOLUTION: With counter surfaces 1a and 2a of contact blocks 1 and 2 as starting points, a plurality of CNT3a and 3b are made to grow toward the counter surface, respectively, so that the CNT 3a and 3b contact to cross each other, jointing both of them electrically, to form a CNT bundle 3. Then, the gaps in the CNT bundle 3 that are electrically jointed are packed with metal material 4, forming a wiring 5 that is in compound state of the CNT bundle 3 and the metal material 4. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251701(A) 申请公布日期 2008.10.16
申请号 JP20070089011 申请日期 2007.03.29
申请人 FUJITSU LTD 发明人 NIHEI MIZUHISA;SATO SHINTARO;KONDO DAIYU;AWANO YUJI
分类号 H01L21/3205;B82B1/00;B82B3/00;C23C16/44;H01L21/285;H01L23/52 主分类号 H01L21/3205
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