| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problems that light from a light-emitting element to a board leaks from the board and ends up in light loss that is not used effectively, that a manufacturing process for a reflective structure is complicated, and that heat from the light-emitting element is not dissipated enough resulting in a conspicuous disadvantage of inferior heat dissipation. <P>SOLUTION: A light-emitting device includes a board, a light-emitting element disposed on the board, a sealing resin which covers the light-emitting element and contains an emitter that is excited by the light-emitting element, and a first reflective layer which is formed on the surface of the board that is opposite to the surface on which the light-emitting element is disposed. <P>COPYRIGHT: (C)2009,JPO&INPIT |
