| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board capable of reducing mounting failure of electronic components due to a gas generated while being heated. SOLUTION: The manufacturing method of a wiring board comprises a coating process for coating a connection pad of a substrate having the connection pad with solder paste; a loading process for loading electronic components on the coated solder paste; an arrangement process for arranging a lid body on the substrate so that the electronic components are covered; and a heating process for heating the substrate where the lid body is arranged. The lid body has a communication section for allowing space, formed between the lid body and the electronic component to communicate with the external space of the lid body. COPYRIGHT: (C)2009,JPO&INPIT
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