发明名称 Multi-Chip Module
摘要 A multi-chip module includes at least one integrated circuit chip that is electrically connected to first external terminals of the multi-chip module and at least one power semiconductor chip that is electrically connected to second external terminals of the multi-chip module. All first external terminals of the multi-chip module are arranged in a contiguous region of an terminal area of the multi-chip module.
申请公布号 US2008251912(A1) 申请公布日期 2008.10.16
申请号 US20070733679 申请日期 2007.04.10
申请人 OTREMBA RALF;HOEGLAUER JOSEF;LANDAU STEFAN;HUBER ERWIN 发明人 OTREMBA RALF;HOEGLAUER JOSEF;LANDAU STEFAN;HUBER ERWIN
分类号 H01L23/02;H01L21/58 主分类号 H01L23/02
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