发明名称 LEAD FRAME, MOLDING DIE, AND MOLDING METHOD
摘要 In a lead frame ( 36 ), inner leads ( 4 ), the terminal ends of support leads ( 2 ), and a die pad ( 3 ) are disposed in a molding area ( 11 ) molded with a molding resin ( 13 ) and a frame ( 1 ), the leading ends of the support leads ( 2 ), outer leads ( 5 ), and tie bars ( 6 ) are disposed outside the molding area ( 11 ). In the frame ( 1 ), slits ( 16 ) are formed by cutting on both sides of corners ( 15 ) disposed on the extension lines of the leading ends of the support leads ( 2 ).
申请公布号 US2008253104(A1) 申请公布日期 2008.10.16
申请号 US20080045805 申请日期 2008.03.11
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 INUI TADAHISA
分类号 H05K7/20;B29C33/00;B29C70/72 主分类号 H05K7/20
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