| 摘要 |
An infrared sensor has a groove formed at a peripheral portion of an optical filter in a region opposed to a circumferential region of an opening of a package so as to be continuously located in the peripheral portion of the optical filter. The optical filter has a resistance of about 1 MOmega/cm or less. The package is mainly composed of a metal material. A conductive adhesive is used as an adhesive for joining the optical filter to the package. In a case where the optical filter has a filter body and a thin film made of an insulating material and provided on a surface of the filter body, the groove is formed to have a depth extending from the surface provided with the thin film made of the insulating material to the filter body.
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