发明名称 HOUSING STRUCTURE OF CAMERA MODULE
摘要 A housing structure of a camera module is provided to enable overflow preventing grooves to be formed in at least one inner surface of a lower wall of a housing, thereby preventing a bonding agent from overflowing to the outside of the housing to improve the reliability of the housing structure. A housing structure(100) of a camera module includes an IR(Infrared) filter mounting portion(140), a substrate supporting portion(120), and a lower wall(110). An IR filter is mounted on the IR filter mounting portion. The IR filter cuts off infrared rays in light incident from an upper portion at an inner arbitrary point. An outline portion of a substrate is closely coupled to the substrate supporting portion in the lower part of the IR filter mounting portion. A plurality of parts is mounted on the substrate. The lower wall is extended to the lower part of the substrate supporting portion. The lower wall has overflow preventing grooves(111). The overflow preventing grooves prevents an outflow of a bonding agent interposed between the substrate supporting portion and the outline portion of the substrate.
申请公布号 KR100863798(B1) 申请公布日期 2008.10.16
申请号 KR20070039667 申请日期 2007.04.24
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 CHOI, JAE HO;CHOI, HYUNG MIN
分类号 H04N5/225 主分类号 H04N5/225
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