发明名称 TOOL FOR CARRYING SUBSTRATE, COMPONENT PACKAGING METHOD, AND COMPONENT PACKAGING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a tool for carrying a substrate that carries the substrate while preventing damage to the thinned substrate having a component packaging region at the edge, and to provide a component packaging method, and a component packaging apparatus. <P>SOLUTION: The tool for carrying a substrate comprises: a first plate member where the substrate is placed while a component packaging region arranged at the edge of the substrate is positioned outside the edge of the plate; a second plate member arranged so that the substrate is held between the second plate member itself and to the first plate member while the component packaging region is positioned outside the edge of the plate; and a fixing section for fixing the first and second plate members and holding the state where the substrate is sandwiched by respective plate members so that the state can be released. The tool for carrying a substrate holds the thinned substrate for conveyance. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251787(A) 申请公布日期 2008.10.16
申请号 JP20070090565 申请日期 2007.03.30
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TSUJI SHINJIRO
分类号 H05K13/04;G09F9/00;H05K3/32 主分类号 H05K13/04
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