发明名称 PLASMA PROCESSING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To enable to suck treated gas uniformly along the fringe part of a processing region in the plasma processing. <P>SOLUTION: A nozzle part 12 is installed on the processing gas injection direction side of a plasma generation part 11. The nozzle part 12 is constructed of a plurality of plates 31-33, 35 laminated in injection direction. Wide recessed groove parts 51, 53 are formed as a suction path 50 surrounding an injection port 35a on one of overlapping faces of the mutually overlapping two plates, and narrow through hole parts 52, 54, 55 consisting of slits or aligned holes are formed at the plate 35 on the topmost end side and the other plates 32, 33. The recessed groove parts and the through hole parts 51-55 extend respectively along the processing region 19. The through hole part 55 of the plate 35 constitutes a suction port at the upstream end of the suction path 50 and demarcates the fringe part of the processing region 19. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008251233(A) 申请公布日期 2008.10.16
申请号 JP20070088367 申请日期 2007.03.29
申请人 SEKISUI CHEM CO LTD 发明人 TAKEUCHI TOSHIKIMI
分类号 H05H1/24;B08B7/00;H01L21/3065 主分类号 H05H1/24
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