| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component that can prevent generation of expansion of plating during a plating process, without causing increase in the manufacturing steps and manufacturing cost, and provide a manufacturing process of electronic component. <P>SOLUTION: In the manufacturing process of electronic component, expansion of plating can be prevented, when a second metal electrode layer 34 and a third metal electrode layer 36 are formed, by forming a glass layer 40 at an edge of a first metal electrode layer 32 on the front surface of a ceramic raw material 10. The glass layer 40 is formed simultaneously with the baking of the first metal electrode layer 32, by compressing a metal substance derived from substantially spherical powder and scale piece powder contained in conductive paste to the internal side of the predetermined region. Therefore, accordingly, the glass layer 40 can be formed to prevent generation expansion of plating, without causing increase in the number of manufacturing steps and the manufacturing cost. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
