| 摘要 |
PROBLEM TO BE SOLVED: To provide a die attach paste for a semiconductor or an adhesive material for a heat releasing member having a low elastic modulus and good adhesion, as well as to provide a semiconductor device excellent in the reliability on reflow resistance, etc. SOLUTION: This resin composition comprises a compound (A), represented by formula (1), that joins the semiconductor or the heat releasing member to a substrate. The semiconductor device is produced using the resin composition as the die attach paste or the adhesive material for the heat releasing member. COPYRIGHT: (C)2009,JPO&INPIT
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