| 摘要 |
<p>An acoustic sensor is disclosed which can be fabricated on a single chip with an electronic detection circuit by modular integration of the fabrication processes. An advantage of the disclosed acoustic sensor with on-chip signal detection circuit is smaller overall device size and lower sensitivity to electromagnetic interference and vibration. A second advantage of the disclosed acoustic sensor is the combined stress-relief and electrostatic clamping design of the diaphragm, which allows for further reduction of the diaphragm size, and hence device size, without compromising the microphone acoustic sensitivity, and at same time eliminates issues with diaphragm bow normally associated with stress-relief techniques.</p> |
