发明名称 CAMERA MODULE
摘要 A camera module is provided to form protrusions in a side of a shield case to enable a side of the shield case to hold a predetermined gap from a side of a housing and a side pad of a substrate, thereby preventing a short circuit that a lower end portion of the shield case is connected to the side pad of the substrate to improve the reliability of the camera module. A camera module includes a substrate(10), an optical case, and a shield case(40). An image sensor is mounted on the substrate. A side pad(11) for a side connection is formed on the substrate. The optical case is installed in the upper part of the substrate. The optical case includes a housing(20) and a lens barrel(30). The housing is installed on the upper part of the substrate. The lens barrel is installed on the upper part of the housing. A lens group is installed in the lens barrel. The shield case is installed to surround the optical case to cut off the EMI(Electromagnetic Interference) of electronic parts such as the image sensor. A gap holding unit is formed on the shield case to hold a gap from a side of the optical case. The gap holding unit is protrusions protruded to an inner side of the shield case from the side of the shield case corresponding to the side of the shield case. The protrusions are formed in the side of the shield case and are formed at a close position within a range that the protrusions do not interfere with the side pad of the substrate.
申请公布号 KR100863800(B1) 申请公布日期 2008.10.16
申请号 KR20070064991 申请日期 2007.06.29
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, JAE SUN;LEE, KANG JIN
分类号 H04N5/225;G02B7/02 主分类号 H04N5/225
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