| 摘要 |
PROBLEM TO BE SOLVED: To obtain a package for accommodating a semiconductor element and a semiconductor device capable of being effectively manufactured and excellent in mass production and in operability for a high frequency signal. SOLUTION: There are provided a flat plate 2 having a placement 2a of the semiconductor element 13, a suspension lead 4 coupled with a lead frame 1, a circular hole 5 provided on the extension line of the suspension lead 4; a lead terminal 3 extending toward the flat plate 2, a ceramic frame 11 where a through hole 11c is formed in the bottom surface of a recessed part, a metallized wiring layer 11a formed from the inside of the recessed part to the outer periphery of a lower surface and connected to the lead terminal 3, and a metallized layer 11b formed around the through hole 11c in the lower surface and brazed to the flat plate 2. A coupling part 6 between the suspension lead 4 and the lead frame 1 is progressively increased in its width from the suspension lead 4 to the lead frame 1, and the circular hole 5 partly overlaps the coupling part 6, but the center thereof is located outside the coupling part 6. COPYRIGHT: (C)2005,JPO&NCIPI |
