| 摘要 |
A needle of a probe card and the probe card are provided to reliably connect the needle to a pad by reducing a contact size between the probe unit and the pad. A needle of a probe card includes a probe unit(210), a soldering unit(230), and a beam unit(220). The probe unit is contacted with a pad of a wafer die with a predetermined needle pressure. No plating layer is formed outside the probe unit. The soldering unit is soldered on a circuit board of the probe card, such that a signal is delivered to the probe unit. The beam unit couples the probe unit with the soldering unit. The beam unit has an elastic property, such that the probe unit is contacted with the pad of the wafer die at the predetermined needle pressure. The beam unit is plated. |
