| 摘要 |
<p>The method involves determining temperature measured by a sensor (SN) and average power losses of a semiconductor power module (M1) by estimating case temperature of the model from a predefined thermal model. The model integrates thermal transimpedance representing thermal influence of the module on other semiconductor power modules (M2, M3). Junction-case temperature is determined from the case temperature and limit value of the junction temperature. The junction temperature is reduced to a preset limit value of the junction temperature. An independent claim is also included for a system for managing temperature in a speed variator.</p> |
