发明名称 Semiconductor device, led head and image forming apparatus
摘要 <p>A semiconductor device is supplied which is able to efficiently liberate heat produced by semiconductor element toward external, prevent temperature rise, improve operation characteristic and maintain stable operation. The semiconductor device comprises a substrate and a semiconductor thin film layer which is accumulated on the substrate and contains semiconductor element, the substrate is a metal substrate, between the metal substrate and the semiconductor thin film layer, a diamond-like carbon layer with high heat conductivity and good insulativity is furnished as a surface coating layer.</p>
申请公布号 EP1981094(A2) 申请公布日期 2008.10.15
申请号 EP20080154435 申请日期 2008.04.11
申请人 OKI DATA CORPORATION 发明人 OGIHARA, MITSUHIKO;SAGIMORI, TOMOHIKO;SUZUKI, TAKAHITO;FUJIWARA, HIROYUKI;IGARI, TOMOKI;SAKUTA, MASAAKI
分类号 H01L33/08;H01L33/32;H01L33/64 主分类号 H01L33/08
代理机构 代理人
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