| 摘要 |
A process for manufacturing radiation shield structures of the type consisting of neutron absorbing boron carbide particles embedded in a copper matrix. The material comprises a multiplicity of particles comprising a core of boron carbide, a film of electroless copper bonded to the carbide, and a relatively thick electrodeposited copper layer bonded to the film. The particles are then consolidated to produce shield structures by hot rolling or hot pressing, with or without sintering.
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