| 摘要 |
A method for processing a substrate and a chip manufactured thereby are provided to prevent corrosion caused by a wet process and to improve a chipping effect and generation of cracks in a lateral direction. A plurality of chips are formed on a substrate(1). A plurality of cracks are formed in the substrate by using an ultrasonic scribing device(10). A plasma process for a rear surface of the substrate is performed. The cracks of the substrate are formed vertically to a thickness direction of the substrate. The cracks are formed to discriminate the chips from each other. A polishing process is performed to polish the rear surface of the substrate before the plasma process. The polishing process is a dry type polishing process.
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