发明名称 METHOD AND APPARATUS FOR CUTTING LAMINATED CERAMIC ELEMENTS
摘要 A cutting device of a ceramic laminator and a cutting method thereof are provided to reduce the number of manufacturing process and minimize a working loss by preventing a ceramic laminator which is fixed by a magnetic force, from being scattered. A cutting device of a ceramic laminator includes a stage(10), a magnetic force fixing unit(12), a buffering plate(14), and a ceramic laminator(15). The stage of a plate shape has a heating line which is radiated by applying a current. The magnetic force fixing unit is installed on a top plane of the stage. The buffering plate is recovered to have a height different from the top plane of the stage on an upper plane of the magnetic fixing unit. The ceramic laminator is fixed on the top plane of the buffering plate by a magnetic force radiated through the magnetic fixing unit. The magnetic fixing unit is a permanent magnet.
申请公布号 KR20080092020(A) 申请公布日期 2008.10.15
申请号 KR20070035286 申请日期 2007.04.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 KIM, DONG JIN;KOO, JA ICK;LEE, YONG SOO;KIM, SE HYUN;HYUN, BYOUNG YONG;OU, GANG SUK;LIM, JIN HYUNG;KIM, YONG HWAN;LEE, KYUNG HO;PARK, JUNG SIK
分类号 H01G4/30;H01G13/00 主分类号 H01G4/30
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