<p>The module has a power semiconductor component (70a) arranged on a substrate with its main surface and facing the substrate. The component (70a) is connected with a printed circuit board (56a) comprising a load potential and control potential. Another power semiconductor component (70b) is arranged on the substrate with its another main surface and facing the substrate and connected with another printed circuit board (54) comprising a load potential. Load connecting units are arranged and connected to load connecting surfaces (72,76) of the components in an electrically conducting manner.</p>
申请公布号
AT409357(T)
申请公布日期
2008.10.15
申请号
AT20060020503T
申请日期
2006.09.29
申请人
SEMIKRON ELEKTRONIK GMBH & CO. KG PATENTABTEILUNG
发明人
BECKEDAHL, PETER;GOEBL, CHRISTIAN;SCHLOETTERER, ANDRE