发明名称 METHODS OF FORMING FIELD EFFECT TRANSISTORS AND METHODS OF FORMING INTEGRATED CIRCUITRY COMPRISING A TRANSISTOR GATE ARRAY AND CIRCUITRY PERIPHERAL TO THE GATE ARRAY
摘要 <p>The invention includes methods of forming field effect transistors, methods of forming field effect transistor gates, methods of forming integrated circuitry comprising a transistor gate array and circuitry peripheral to the gate array, and methods of forming integrated circuitry comprising a transistor gate array including first gates and second grounded isolation gates. In one implementation, a method of forming a field effect transistor includes forming masking material over semiconductive material of a substrate. A trench is formed through the masking material and into the semiconductive material. Gate dielectric material is formed within the trench in the semiconductive material. Gate material is deposited within the trench in the masking material and within the trench in the semiconductive material over the gate dielectric material. Source/drain regions are formed. Other aspects and implementations are contemplated.</p>
申请公布号 EP1979937(A2) 申请公布日期 2008.10.15
申请号 EP20070749192 申请日期 2007.01.23
申请人 MICRON TECHNOLOGY, INC. 发明人 KIM, YOUNG PIL;PAREKH, KUNAL, R.
分类号 H01L29/423;H01L21/8234;H01L29/66 主分类号 H01L29/423
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