发明名称 Chip card manufacturing procedure limiting the mechanical stresses on it
摘要 <p>A microcircuit (19) is glued (26) to a conducting skeleton (16) such that the microcircuit connections are made to the skeleton (16) by virtue of microcircuit protuberances, or the use of an anisotropic glue. The skeleton is then further secured by a drop of resin, cut to size, lowered into a cavity in the card and secured by gluing. The surface of the microcircuit card is finally made good by additional glue</p>
申请公布号 EP0971313(B1) 申请公布日期 2008.10.15
申请号 EP19990401517 申请日期 1999.06.18
申请人 OBERTHUR TECHNOLOGIES 发明人 VENAMBRE, JACQUES;BOUCHEZ, FRANCOIS
分类号 G06K19/077;H05K3/20 主分类号 G06K19/077
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